MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display
April 25, 2012 --
San Jose, CA (PRWEB) April 25, 2012
MonolithIC 3D Inc., a Silicon Valley startup, announced today that the USPTO has issued MonolithIC 3D three additional patents on monolithic 3D IC, 3D logic and integration with image sensor or micro display, and 3D Memories. This milestone increases the companys portfolio of issued patents from 7 to 10 over the previous ten months. These issued patents are joined by over 50 pending applications. This makes the company one of the key players in the 3D-IC field. On the companys webpage you can find the complete list of issued patents and details about the innovative technology it provides.
The first issued patent this month, US #8,148,728, describes monolithic 3D devices utilizing junction-less transistors. Junction-less transistors were proposed in the very early days of the semiconductor industry. This type of transistor has become very attractive at feature sizes of 20 nm and below. Monolithic 3D provides a very attractive alternative to dimensional scaling especially in view of the uncertainty and costs associated with next generation lithography. Zvi Or-Bach, President and CEO of MonolithIC 3D Inc., said, "We are very pleased for being granted these fundamental patents recognizing the companys monolithic 3D IC enabling breakthrough. MonolithIC 3D Inc. is committed to the promotion of the 3D IC as the preferred path to continue device integration per Moores' Law. We believe these issued patents will help us motivate early adopters to bring monolithic 3D IC to the market".
The second patent issued, US #8,153,499, provides very broad coverage for the companys monolithic 3D IC technology, and US #8,163,581 extends the companys patent coverage to Electro-Optic devices such as the multi-Spectrum image sensor and the micro-display. The USPTO has continued to recognize the innovative methods, devices, and systems that MonolithIC 3D Inc. is bringing to the semiconductor industry. We will continue to expand our IP portfolio with practical monolithic 3D IC solutions, said Brian Cronquist, VP of Technology & IP at MonolithIC 3D Inc.
Further details of MonolithIC 3D Inc.s technologies are available on its website. The companys business model involves Intellectual Property (IP) Licensing to partners who then take the technology to manufacturing.
About MonolithIC 3D Inc.
MonolithIC 3D Inc. is an IP company dedicated to innovation in semiconductor design and fabrication. It invented and developed a practical path to the monolithic 3D Integrated Circuit, which includes multiple derivatives for Logic, Memory and Electro Optic devices. The company was selected as a finalist of the Best of West 2011, which recognizes the most important product and technology developments at Semicon West.
Read the full story at http://www.prweb.com/releases/2012/4/prweb9438838.htm.